Stress concentration analysis in composite and orthotropic plates is a critical area of research that addresses the localisation of stress in regions of geometric discontinuity, such as holes or ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The cause of failure in engineering structures is routinely investigated via the detailed study of material fracture surfaces. This remains a key research area in material sciences, with researchers ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...